With technology scaling, power densities have steadily increased making our current and upcoming chips thermally constrained due to the harmful effects of high temperature on the correct functionality of on-chip systems. Spatial and temporal thermal gradients across the chip can seriously jeopardize its reliability due to different mechanisms such as electromigration. Importantly, high on-chip temperatures contribute to faster chip aging which considerably shortens the lifetime of chips. This trend makes developing thermal management techniques is essential to maintain a reliable operation of chips during their lifetime. In addition, performing accurate thermal analysis is a prerequisite for evaluating the efficiency of any applied technique. To investigate the thermal behavior of a chip, thermal simulations have traditionally been employed. Additionally, direct thermal measurements can be obtained using the available on-chip thermal sensors. Recently, state-of-the-art started to employ an infrared camera to capture the thermal images of chips in order to have an accurate baseline to compare against.
Language: english (main), german (alternative).
Meeting schedule: will be informed by email.
Application: via registration form.