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Thermal-aware Embedded Systems

Thermal-aware Embedded Systems
type: Seminar (S) links:
semester: WS 17/18
lecturer: Dr.-Ing. Hussam Amrouch
Prof. Dr.-Ing. Jörg Henkel
SWS: 2
lv-no.: 2424088
Content of teaching

Learning target:

State-of-the-art thermal management techniques in both research and industry, like Intel Turbo Boost technique.

Impact of temperature on the lifetime of chips.


With technology scaling, on-chip power densities have steadily increased mak-ing our current and upcoming chips thermally constrained due to the harmful effects of high temperature on the correct functionality of on-chip systems. Spatial and temporal thermal gradients across the chip can seriously jeopardize its reliability due to a wide range of failure mechanisms.

Importantly, high on-chip temperatures contribute to faster chip aging which considerably shortens the lifetime of chips. This trend makes developing ther-mal management techniques essential to maintain a reliable operation of chips during their lifetime. In addition, performing accurate thermal analysis is a pre-requisite for evaluating the efficiency of any applied technique.

To investigate the thermal behavior of a chip, thermal simulations have tradi-tionally been employed. Additionally, direct thermal measurements can be ob-tained using the available on-chip thermal sensors. Recently, state of the art started to also employ an infrared camera to capture the thermal images of chips.