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Thermal-aware Embedded Systems

Thermal-aware Embedded Systems
type: Seminar (S) links:
semester: WS 16/17

Dr.-Ing. Hussam Amrouch
Prof.Dr.Ing. Jörg Henkel

SWS: 2
lv-no.: 24088

With technology scaling, power densities have steadily increased making our current and upcoming chips thermally constrained due to the harmful effects of high temperature on the correct functionality of on-chip systems. Spatial and temporal thermal gradients across the chip can seriously jeopardize its reliability due to different mechanisms such as electromigration. Importantly, high on-chip temperatures contribute to faster chip aging which considerably shortens the lifetime of chips. This trend makes developing thermal management techniques is essential to maintain a reliable operation of chips during their lifetime. In addition, performing accurate thermal analysis is a prerequisite for evaluating the efficiency of any applied technique. To investigate the thermal behavior of a chip, thermal simulations have traditionally been employed. Additionally, direct thermal measurements can be obtained using the available on-chip thermal sensors. Recently, state-of-the-art started to employ an infrared camera to capture the thermal images of chips in order to have an accurate baseline to compare against.

Language: English (main), German (alternative).

Meeting schedule: will be informed by email.