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Amrouch

Dr.-Ing. Hussam Amrouch

Research Group Leader
room: B2-312.1
phone: +49 721 608-45733
fax: +49 721 608-43962
amrouchYef5∂kit edu


Haid-und-Neu-Str. 7
Bldg. 07.21
76131 Karlsruhe


Short Bio

Hussam Amrouch is currently a research group leader of the "Dependable Hardware" group at the Chair for Embedded Systems (CES) at the Karlsruhe Institute of Technology (KIT). He received in 03.06.2015 his Ph.D. in Computer Science (Dr.-Ing.) with distinct "Summa Cum Laude, mit Auszeichnung" from KIT, Germany under the supervision of Prof. Jörg Henkel. He received his B.Sc. degree in Computer Engineering from the University of Aleppo in 2007 with an excellent note and the first rank position. He had been awarded with the "Top Student Award" among all bachelor graduate students of the faculty of Electrical Engineering.
His main research interests are Emerging Technology (NCFET and FeFET), Design for Security and Design for Reliability with a special focus on investigating (from semiconductor physics to the system level) the effects of transistor aging, temperature and soft errors. During his Ph.D. studies, Dr. Amrouch had developed the first thermal measurement setup that allows infrared cameras to perspicuously capture the thermal images of processor chips without any interference layer.
Dr. Amrouch serves as an associate editor at  Integration, the VLSI Journal and a TPC memeber in several computer science conferences as well as a reviewer in many top journals like T-ED, TCAS-I and TC.
Dr. Amrouch was interviewed by the KIT-Dialog magazine regarding his research work as well as by the KIT magazine for Research, Teaching and Innovations (LooKKIT) regarding his work on Security for Cyber-Physical Systems. An article in the Frankfurt General Newspaper (Frankfurter Allgemeine Zeitung) was also published regarding his research. Dr. Amrouch was also interviewed by the German public broadcasting radio (Deutschlandfunk) regarding his recent work.
Dr. Amrouch received three Best Paper Award Nominations at DAC'17, DAC'16 and DATE'17 as well as 7 HiPEAC Awards.

 

Research Interests

Dependable Hardware Research Group (click here)

  • Design for Reliability:
    • Device-Circuit Interaction: aging, process variation, soft errors, self-heating.
    • Aging-aware and thermal-aware circuit design.
    • System-level modeling and optimization.
  • Emerging Technology:
    • Post-CMOS technology and non-volatile memories.
  • Design for Security:
    • Reliability degradation-induced security threats.
    • Impact of emerging technology on security.
  • Advanced Cooling Solutions:
    • Device and chip modeling.
  • Machine Learning
  • Approximate Computing

 

Publications

Journals / Transactions
Guilherme Paim, Leandro M. G. Rocha,Hussam Amrouch, Eduardo A. C. da Costa, Sergio Bampi and Jörg Henkel
A Cross-layer Gate-Level-to-Application Co-simulation for Design Space Exploration of Approximate Circuits in HEVC Video Encoders
in IEEE Transactions on Circuits and Systems for Video Technology (TCSVT), (accepted), 2019.
Hussam Amrouch, Sami Salamin, Girish Pahwa, Amol Gaidhane, Jörg Henkel,Yogesh Singh Chauhan
Unveiling the Impact of IR-drop on Performance Gain in NCFET-based Processors
in IEEE Transactions on Electron Devices (TED), (accepted), 2019
Hussam Amrouch, Borna Ehsani, Andreas Gerstlauer, and Jörg Henkel
On the Efficiency of Voltage Overscaling under Temperature and Aging Effects
in IEEE Transactions on Computers (TC'19) (accepted), 2019
Sami Salamin, Victor M. van Santen, Hussam Amrouch, Narendra Parihar, Souvik Mahapatra, and Jörg Henkel
Modeling the Interdependencies between Voltage Fluctuation and BTI Aging
in IEEE Transactions on Very Large Scale Integration Systems (TVLSI), 2019
Victor M. van Santen, Hussam Amrouch and Jörg Henkel
Modeling and Mitigating Time-Dependent Variability from the Physical Level to the Circuit Level
in IEEE Transactions on Circuits and Systems I: Regular Papers (TCAS-I), 2019.
Victor M. van Santen, Hussam Amrouch and Jörg Henkel
New Worst-Case Timing for Standard Cells under Aging Effects
in IEEE Transactions on Device and Materials Reliability (T-DMR), (accepted), 2019.
Thirunavukkarasu A, Hussam Amrouch, Jerin Joe, Nilesh Goel, Narendra Parihar, Subrat Mishra, Chetan K. Dabhi, Yogesh S. Chauhan, Jörg Henkel and Souvik Mahapatra
A Device to Circuit Framework for Activity Dependent NBTI Aging in Digital Circuits
in IEEE Transactions on Electron Devices (TED), (accepted), 2018.
Subrat Mishra, Hussam Amrouch, Jerin Joe, Chetan K Dabhi, Karansingh Thakor, Yogesh S Chauhan, Jörg Henkel and Souvik Mahapatra
A Simulation Study of NBTI Impact on 14nm node FinFET Technology for Logic Applications: Device Degradation to Circuit Level Interaction
in IEEE Transactions on Electron Devices (TED), (accepted), 2018.
Victor M. van Santen, Hussam Amrouch and Jörg Henkel
Modeling and Evaluating the Gate Length Dependence of BTI
in IEEE Transactions on Circuits and Systems II (TCAS-II), (accepted), 2018.
Behnam Khaleghi, Behzad Omidi, Hussam Amrouch, Jörg Henkel and Hossein Asadi
Estimating and Mitigating Aging Effects in Routing Network of FPGAs
in IEEE Transactions on VLSI Systems (TVLSI), (accepted), 2018.
Hussam Amrouch, Girish Pahwa, Amol Gaidhane, Jörg Henkel, Yogesh Singh Chauhan
Negative Capacitance Transistor to Address the Fundamental Limitations in Technology Scaling: Processor Performance
in IEEE Access, (accepted), 2018.
Heba Khdr, Hussam Amrouch and Jörg Henkel
Dynamic Guardband Selection: Thermal-Aware Optimization for Unreliable Multi-Core Systems
in IEEE Transactions on Computers (TC), (accepted), 2018.
Heba Khdr, Hussam Amrouch and Jörg Henkel
Aging-Aware Boosting
in IEEE Transactions on Computers (TC), (accepted to), 2018.
Victor M. van Santen,  Javier Martin-Martinez, Hussam Amrouch, Montserrat Nafria, Jörg Henkel
Reliability in Super- and Near-Threshold Computing: A Unified Model of RTN, BTI and PV
in IEEE Transactions on Circuits and Systems I (TCAS-I), pp. 1 - 14, 2017.
Sheldon X.-D. Tan, Hussam Amrouch, Taeyoung Kim, Zeyu Sun, Chase Cook, Jörg Henkel
Recent Advances in EM and and BTI induced Reliability Modeling, Analysis and Optimization
in Integration, the VLSI Journal, (accepted), (Invited), 2017
Hussam Amrouch, Victor M. van Santen, Jörg Henkel
Interdependencies of Degradation Effects and their Impact on Computing
in IEEE Design & Test,
Vol.34, Issue 3, pp. 59-67, June 2017.
Hussam Amrouch, Thomas Ebi, Jörg Henkel
RESI: Register-Embedded Self-Immunity for Reliability Enhancement
in IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD),
Vol. 33, Issue 5, pp. 677-690, May 2014.
Conferences
Sheriff Sadiqbatcha, Yue Zhao, Jinwei Zhang, Hussam Amrouch, Jörg Henkel, Sheldon Tan
Machine Learning Based Online Full-Chip Heatmap Estimation
in 25th Asia and South Pacific Design Automation Conference, ASP-DAC, Beijing, China, Jan. 13 - 16, 2020.
Jörg Henkel, Hussam Amrouch, Martin Rapp, Sami Salamin, Dayane Reis, Di Gao , Xunzhao Yin, Michael Niemier, Cheng Zhuo, X. Sharon Hu, Hsiang-Yun Cheng, Chia-Lin Yang
The Impact of Emerging Technologies on Architectures and System-level Management (special session)
in IEEE/ACM 38th International Conference on Computer-Aided Design (ICCAD),Westminster, CO, November 4-7, 2019.
Hussam Amrouch, Victor van Santen, Om Prakash, Hammam Kattan, Sami Salamin, Simon Thomann, and Jörg Henkel
Reliability Challenges with Self-Heating in FinFET Technology
in IEEE 25th International Symposium on On-Line Testing And Robust System Design (IOLTS'19), (special session) 2019
Sami Salamin, Martin Rapp, Hussam Amrouch, Girish Pahwa, Yogesh S. Chauhan, and Jörg Henkel
NCFET-Aware Voltage Scaling
in IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED'19), July, 2019.
Martin Rapp, Sami Salamin, Hussam Amrouch, Girish Pahwa, Yogesh S. Chauhan and Jörg Henkel
Performance, Power and Cooling Trade-Offs with NCFET-based Many-Cores
in ACM/EDAC/IEEE 56rd Design Automation Conference (DAC), Las Vegas, USA, June 2 - 6, 2019.
Jongho Kim, Heesu Kim, Hussam Amrouch, Jörg Henkel, Andreas Gerstlauer, Kiyoung Choi
Aging Gracefully with Approximation
in IEEE International Symposium on Circuits and Systems (ISCAS), Japan, May 26-29, 2019.
Frank Sill Torres, Hussam Amrouch, Jörg Henkel and Rolf Drechsler
Impact of NBTI on Increasing the Susceptibility of FinFET to Radiation
in IEEE 56th International Reliability Physics Symposium (IRPS), CA, USA, March 31 - April 4, 2019.
Sami Salamin, Hussam Amrouch and Jörg Henkel
Selecting the Optimal Energy Point in Near-Threshold Computing (regular)
in in IEEE/ACM 22nd Design, Automation and Test in Europe Conference (DATE'19), Florence, Italy, (accepted), March 25 - 29, 2019.
Sheriff Sadiqbatcha, Hengyang Zhao, Hussam Amrouch, Jörg Henkel and Sheldon Tan
Hot Spot Identification and System Parameterized Thermal Modeling for Multi-Core Processors Through Infrared Thermal Imaging (regular)
in in IEEE/ACM 22nd Design, Automation and Test in Europe Conference (DATE'19), Florence, Italy, (accepted), March 25 - 29, 2019.
Hussam Amrouch, Victor van Santen and Jörg Henkel
Estimating and Optimizing BTI Aging Effects: From Physics to CAD (special session)
in IEEE/ACM 37th International Conference on Computer-Aided Design (ICCAD), San Diego, CA, November 5-8, 2018.
Jörg Henkel, Jürgen Teich, Stefan Wildermann and Hussam Amrouch
Dynamic Resource Management for Heterogeneous Many-Cores (special session)
in IEEE/ACM 37th International Conference on Computer-Aided Design (ICCAD), San Diego, CA, November 5-8, 2018.
Behzad Boroujerdian, Hussam Amrouch, Jörg Henkel and Andreas Gerstlauer
Trading off temperature guardbands via adaptive approximations
in International Conference on Computer Design (ICCD), Florida, USA, October 7-10, 2018.
Hussam Amrouch, Behnam Khaleghiy and Jörg Henkel
Voltage Adaptation under Temperature Variation (special session)
in 15th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), Prague, Czech Republic, July 2 -5, 2018
Victor M. van Santen, Hussam Amrouch and Jörg Henkel
Reliability Estimations of Large Circuits in Massively-Parallel GPU-SPICE (special session)
in 24th IEEE International Symposium on On-Line Testing and Robust System Design (IOLTS), Costa Brava, Spain, July 2-4, 2018
Heba Khdr, Hussam Amrouch and Jörg Henkel
Aging-Constrained Performance Optimization for Multi Cores
in ACM/EDAC/IEEE 55rd Design Automation Conference (DAC), San Francisco, CA, USA, June 24-28, 2018 (accepted for publication).
Victor M. van Santen, Javier Diaz-Fortuny, Hussam Amrouch, Javier Martin-Martinez,Rosana Rodriguez, Rafael Castro-Lopez, Elisenda Roca, Francisco V. Fernandez, Jörg Henkel and Montserrat Nafria
Weighted Time Lag Plot Defect Parameter Extraction and GPU-based BTI Modeling for BTI Variability
in IEEE 55th International Reliability Physics Symposium (IRPS), San Francisco , CA, USA,  March 11-15, 2018.
Hussam Amrouch and Jörg Henkel
Evaluating and Mitigating Degradation Effects in Multimedia Circuits
in IEEE/ACM International Conference on Compilers, Architecture, and Synthesis for Embedded Systems (CASES'17), OCTOBER 15-20, Seoul, South Korea, 2017 (Invited paper).
Hussam Amrouch, Prashanth Krishnamurthy, Naman Patel, Jörg Henkel, Ramesh Karri, Farshad Khorrami
Emerging (Un-)Reliability Based Security Threats and Mitigations for Embedded Systems
in IEEE/ACM International Conference on Compilers, Architecture, and Synthesis for Embedded Systems (CASES'17), OCTOBER 15-20, Seoul, South Korea, 2017 (Special Session).
Vasileios Tenentes, Charles Leech, Graeme M. Bragg, Geo Merrett, Bashir M. Al-Hashimi, Hussam Amrouch, Jörg Henkel, Shidhartha Das
Hardware and Software Innovations in Energy-Efficient System-Reliability Monitoring
in in IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT), October 23-25, Cambridge, UK, 2017 (Special Session).
Hussam Amrouch, Behnam Khaleghi, Andreas Gerstlauer, Jörg Henkel
Towards Aging-induced Approximations
in ACM/EDAC/IEEE 54rd Design Automation Conference (DAC),
Austin, TX, USA, June 18-22, 2017.
Hussam Amrouch, Subrat Mishra, Victor M. van Santen, Souvik Mahapatra, Jörg Henkel
Impact of BTI on Dynamic and Static Power: From the Physical to Circuit Level
in IEEE 55th International Reliability Physics Symposium (IRPS),
Monterey, CA, USA, April 2-6, 2017 (accepted for publication).
Hussam Amrouch, Behnam Khaleghi, Jörg Henkel
Optimizing Temperature Guardbands
in IEEE/ACM 20th Design, Automation and Test in Europe Conference (DATE'17),
Laussane, Switzerland, March 27-31, 2017.
Jörg Henkel, Santiago Pagani, Hussam Amrouch, Lars Bauer, Farzad Samie
Ultra-Low Power and Dependability for IoT Devices
in IEEE/ACM 20th Design, Automation and Test in Europe Conference (DATE'17),
Laussane, Switzerland, March 27-31, 2017 (special session paper).
Hussam Amrouch, Jörg Henkel
Containing Guardbands
in 22nd IEEE/ACM Asia and South Pacific Design Automation Conference (ASP-DAC'17), Chiba/Tokyo, Japan,  January 16-19, 2017 (special session paper).
Jörg Henkel, Hussam Amrouch
Designing Reliable, yet Energy-Efficient Guardbands
in 23rd IEEE International Conference on Electronics, Circuits and Systems (ICECS'16), Monte Carlo, Monaco, December 11-14, 2016 (special session paper).
Paul Bogdan, Partha Pratim Pande, Hussam Amrouch, Muhammad Shafique, Jörg Henkel
Power and Thermal Management in Massive Multicore Chips: Theoretical Foundation meets Architectural Innovation and Resource Allocation
in IEEE/ACM International Conference on Compilers, Architecture, and Synthesis for Embedded Systems (CASES'16), Pittsburgh, PA, USA, October 2-7, 2016 (special session paper).
Behnam Khaleghi, Behzad Omidi, Hussam Amrouch, Jörg Henkel, Hossein Asadi
Stress-Aware Routing to Mitigate Aging Effects in SRAM-based FPGAs
in International Conference on Field-Programmable Logic and Applications (FPL), Lausanne, Switzerland, 29 August – 2 September, 2016 (accepted).
Hussam Amrouch, Behnam Khaleghi, Andreas Gerstlauer, Jörg Henkel
Reliability-Aware Design to Suppress Aging
in ACM/EDAC/IEEE 53rd Design Automation Conference (DAC), Austin, TX, USA, Article No. 12, June 5-9, 2016.
Alok Prakash, Hussam Amrouch, Shafique Muhammad, Tulika Mitra, Jörg Henkel
Improving Mobile Gaming Performance through Cooperative CPU-GPU Thermal Management
in ACM/EDAC/IEEE 53rd Design Automation Conference (DAC), Austin, TX, USA, Article No. 47, June 5-9, 2016.
Victor M. van Santen, Hussam Amrouch, Javier Martin-Martinez, Montserrat Nafria, Jörg Henkel
Designing Guardbands for Instantaneous Aging Effects
in ACM/EDAC/IEEE 53rd Design Automation Conference (DAC), Austin, TX, USA, Article No. 69, June 5-9, 2016.
Victor M. van Santen, Hussam Amrouch, Narendra Parihar, Souvik Mahapatra, Jörg Henkel
Aging-Aware Voltage Scaling
in IEEE/ACM 19th Design, Automation and Test in Europe Conference (DATE'16),
Dresden, Germany, March 14-18, pp. 576-581, 2016.
Hussam Amrouch, Jörg Henkel
Reliability Degradation in the Scope of Aging – From Physical to System Level
in I10th IEEE International Design & Test Symposium (IDT’15),
Dead Sea, Jordan, December 14-16, 2015 (invited talk).
Hussam Amrouch, Jörg Henkel
Lucid Infrared Thermography of Thermally-Constrained Processors
in ACM/IEEE International Symposium on Low Power Electronics and Design (ISLPED´15),
Rome, Italy, July 22-24, 2015.
Hussam Amrouch, Javier Martin-Martinez, Victor M. van Santen, Miquel Moras, Rosana Rodriguez, Montserrat Nafria, Jörg Henkel
Connecting the Physical and Application Level Towards Grasping Aging Effects
in IEEE 53rd International Reliability Physics Symposium (IRPS),
Monterey, CA, USA, pp. 3D.1.1-3D.1.8, April 19-23, 2015.
Hussam Amrouch, Victor M. van Santen, Thomas Ebi, Volker Wenzel, Jörg Henkel
Towards Interdependencies of Aging Mechanisms
in IEEE/ACM 33rd International Conference on Computer-Aided Design (ICCAD),
San Jose, CA, USA, pp. 478-485, November 3-6, 2014.
Heba Khdr, Thomas Ebi, Muhammad Shafique, Hussam Amrouch, Jörg Henkel
mDTM: Multi-Objective Dynamic Thermal Management for On-Chip Systems
in The IEEE/ACM 17th Design Automation and Test in Europe Conference (DATE'14),
Dresden, Germany, March 24-28, 2014.
Daniel Palomino, Muhammad Shafique, Hussam Amrouch, Altamiro Susin, Jörg Henkel
hevcDTM: Application-Driven Dynamic Thermal Management for High Efficiency Video Coding
in The IEEE/ACM 17th Design Automation and Test in Europe Conference (DATE'14),
Dresden, Germany, March 24-28, 2014.
Hussam Amrouch, Thomas Ebi, Josef Schneider, Sridevan Parameswaran, Jörg Henkel
Analyzing the Thermal Hotspots in FPGA-based Embedded Systems
in The 23rd INTERNATIONAL CONFERENCE ON FIELD PROGRAMMABLE LOGIC AND APPLICATIONS (FPL’13),
Porto, Portugal, September, 2013.
Hussam Amrouch, Thomas Ebi, Jörg Henkel
Stress Balancing to Mitigate NBTI Effects in Register Files
in The 43rd Annual IEEE/IFIP International Conference on Dependable Systems and Networks (DSN'13),
Budapest, Hungary, pp. 1-10, June 24 - 27, 2013.
Abdulazim Amouri, Hussam Amrouch, Thomas Ebi, Jörg Henkel, Mehdi Tahoori
Accurate Thermal-Profile Estimation and Validation for FPGA-Mapped Circuits
in The 21st IEEE International Symposium on Field-Programmable Custom Computing Machines (FCCM’13),
Seattle, Washington, USA, pp. 57 - 60, April 28-30, 2013.
Jörg Henkel, Thomas Ebi, Hussam Amrouch, Heba Khdr
Thermal Management for Dependable on-chip Systems
in The 18th Asia and South Pacific Design Automation Conference (ASP-DAC’13),
Yokohama, Japan, pp. 113-118, January, 2013.
Thomas Ebi, Hussam Amrouch, Jörg Henkel
COOL: Control-based Optimization Of Load-balancing for Thermal Behavior
in IEEE International Conference on Hardware/Software Codesign and SystemSynthesis (CODES+ISSS´12),
Tampere, Finland, pp. 255-264, October, 2012.
Hussam Amrouch, Jörg Henkel
Self-Immunity Technique to Improve Register File Integrity against Soft Errors
in The 24th International Conference on VLSI Design (VLSID’11),
Chennai, India, pp. 189-194, January, 2011.
Workshops
Hussam Amrouch, Jörg Henkel
Containing Guardbands: From the Macro to Micro Time Domain
in 20. Workshop „Methoden und Beschreibungssprachen zur Modellierung und Verifikation von Schaltungen und Systemen (MBMV’17)”,
Haus der Wissenschaft, Bremen, Germany, 8. - 9. Februar 2017.
Books / Book Chapter
  Hussam Amrouch, Heba Khdr and Jörg Henkel
Aging Effects: From Physics to CAD
in Chapter in Harnessing Performance Variability in Embedded and High-performance Many/Multi-core Platforms, Springer International Publishing AG, part of Springer Nature
Available Theses

Abbreviation: D - Diploma Thesis, M - Master Thesis, S - Student Work, B - Bachelor Thesis.


Topic Type of work Mentor
Degradation Effects in Microprocessors ( PDF )M/Bvan Santen, Victor / Amrouch, Hussam
OpenCL/CUDA Programing for Reliability Analysis ( PDF )M/Bvan Santen, Victor / Amrouch, Hussam
Reliability of Electrical Circuits ( PDF )M/Bvan Santen, Victor / Amrouch, Hussam

Ongoing projects
Name Type of
work
Titel Mentor
Aqqad, RamiMaster thesisMachine Learning ImplementationAmrouch, Hussam
Bera, ArkidInternshipMachine LearningAmrouch, Hussam
Fuhrmann, SvenStudent helperNon-Volatile MemoryAmrouch, Hussam
Gupta, AniketInternshipDevice ModelingAmrouch, Hussam
Jayasinghe, DarshanaStudent helperSecurityAmrouch, Hussam
Schneider, NathanaelBachelor thesisHigh Performance Circuit Simulationsvan Santen, Victor / Amrouch, Hussam
Sill, FrankInternshipReliabilityAmrouch, Hussam
Stefan, PetrovskiBachelor thesisMachine LearningRapp, Martin / Amrouch, Hussam
Walner, AlbertMaster thesisHigh Performance Circuit Simulationsvan Santen, Victor / Amrouch, Hussam

Finished projects
Name Type of work TitelMentor Completion date
Thomann, SimonBachelor thesisReliability Analysis of SRAM Circuits in Conventional and Emerging Technologiesvan Santen, Victor / Amrouch, Hussam19-09-12
Meinschäfer, MichaelBachelor thesisModeling Self-Heating Dependencies in FinFET Transistorsvan Santen, Victor / Amrouch, Hussam19-05-17
Paim, GuilhermeInternshipApproximate Computing for Video EncodersAmrouch, Hussam19-03-31
Bakhshalipour, MohammadInternshipThermal Modeling of O-Chip Systems with 3D Stack MemoriesAmrouch, Hussam19-03-31
Banscher, FlorianBachelor thesisModeling Self-Heating Effects in FinFET Technologyvan Santen, Victor / Amrouch, Hussam19-02-28
Brandt, Nicholas-PhilipStudent helperThermal Signoff of ChipAmrouch, Hussam18-12-31
Stapelbroek, LukasBachelor thesisPredicting Degration-induces Timing Errors Using Machine LearningAmrouch, Hussam18-11-09
Ehsani, BornaInternshipImpact of Degradation Effects on GPGPUsAmrouch, Hussam18-09-30
Hamada, IslamBachelor thesisHigh Performance Circuit Simulationsvan Santen, Victor / Amrouch, Hussam18-08-24
Joe, JerinInternshipDependable HardwareAmrouch, Hussam / van Santen, Victor18-05-31
Klemme, FlorianMaster thesisReliability Analysis of Circuits under Variability Effectsvan Santen, Victor / Amrouch, Hussam18-05-14
Sharma, PoojaInternshipAnalyzing Workload-induced Aging StressAmrouch, Hussam18-03-31
Prasad, SaranInternshipAging Effects in MicroprocessorsAmrouch, Hussam18-03-31
Fortuny, Javier DiazInternshipAnalyzing RTN and BTI Effects in MOSFETsAmrouch, Hussam17-12-31
Mishra, SubratInternshipDependable HardwareAmrouch, Hussam / van Santen, Victor17-12-31
Kattan, HammamMaster thesisThermal Management Hussam Amrouch17-11-30
Rostek, DanielaDiploma thesisDesign for Reliability in FPGAsAmrouch, Hussam17-10-31
Diep, Fu Lam FlorianDiploma thesisHigh Performance Reliability Estimation of Circuits with CUDAvan Santen, Victor / Amrouch, Hussam17-09-30
Roether, SebastianDiploma thesisA Novel Approach to Standard Cell Simulation in SPICE using Equivalence Classesvan Santen, Victor / Amrouch, Hussam17-09-30
Stapelbroek, LukasStudent research projectImpact of Degradation effects on System LevelAmrouch, Hussam17-09-30
Goyal, PrinceInternshipReliabilityAmrouch, Hussam17-08-31
Brinkmann, SvenDiploma thesisFast, yet Accurate BTI Variability Evaluation at the Physical and Device Levelsvan Santen, Victor / Amrouch, Hussam17-07-06
Nabavi, SaberInternshipReliability in Embedded SystemsAmrouch, Hussam17-06-30
Bücher, TimBachelor thesisMeasuring Aging-induced Degradation in MicroprocessorsAmrouch, Hussam / van Santen, Victor17-05-09
Qattan, MohamadBachelor thesisPower, Temperature and Realibility Measurements in FPGA-based SystemsAmrouch, Hussam17-05-08
Milev, DimitarMaster thesisGPU-based Implementation for State-of-the-Art MOSFET Compact ModellingAmrouch, Hussam / van Santen, Victor17-05-08
Saleh, HussienStudent research projectDependable HardwareAmrouch, Hussam16-10-10
Naqvi, Syed Mohsin AliMaster thesisCircuits ReliabilityAmrouch, Hussam / van Santen, Victor16-10-01
Rostek, Daniela JacintaStudent research projectGraphical User Interface for Reliability Estimation Toolvan Santen, Victor / Amrouch, Hussam 16-09-30
Aazmi, AbdellatifInternshipEvaluating Aging in CircuitsAmrouch, Hussam / van Santen, Victor16-08-31
Kübler, CarinaBachelor thesisReliability and Performance Optimizations for CircuitsAmrouch, Hussam16-08-19
Eisele, Max CamilloBachelor thesisFast, yet Accurate Implementation for Advanced Reliability ModelingAmrouch, Hussam / van Santen, Victor16-08-11
Lang, MatthiasInternshipLow Power Processor DesignAmrouch, Hussam16-04-30
Skinder, MichaelMaster thesisEvaluating the Mutual Influence between the Application and Physical Level on ReliabilityAmrouch, Hussam / van Santen, Victor16-03-07
List, ChristianDiploma thesisEvaluating the Impact of Applications on Simulating Aging EffectsAmrouch, Hussam / van Santen, Victor16-03-07
Bhat, RajeshInternshipCUDA Programming for Rapid Reliability EstimationsAmrouch, Hussam / van Santen, Victor16-02-29
Aqqad, RamiMaster thesisOpenCL Programming for Circuits ReliabilityAmrouch, Hussam / van Santen, Victor15-12-01
Khaleghi, BehnamInternshipReliability of Complex Circuits under Aging EffectsAmrouch, Hussam15-10-15
Eshratifar, Amir ErfanInternshipImpact of Voltage Scaling on ReliabilityAmrouch, Hussam15-10-01
Khaleghi, BehnamInternshipReliability of SRAM Cells under different Physical PhenomenaAmrouch, Hussam / van Santen, Victor14-09-30
van Santen, VictorDiploma thesisModeling and Evaluating the Impact of Aging Phenomena on ReliabilityAmrouch, Hussam14-06-30
Cerny, FlorianStudent research projectThermal Management in Multi-Core ArchitecturesAmrouch, Hussam / Ebi, Thomas 13-11-25
Yuh, Derick BengDiploma thesisEvaluating and Mitigating the Thermal HotSpot in FPGA-based Embedded SystemsAmrouch, Hussam / Ebi, Thomas 13-08-31
Dong, Yun PengBachelor thesisCalibration of Thermal Sensors on the Intel SCCAmrouch, Hussam / Ebi, Thomas13-04-03
Bähr, SteffenStudent research projectThermal Simulation of FPGA and ASIC Micro-architectureAmrouch, Hussam / Ebi, Thomas 13-01-15

Teaching Experience

Supervision

Professional Services

  • Associate Editor:
  • Technical Program Committee (TPC) member:
    • International Conference On Computer Aided Design (ICCAD): 2017, 2018, 2019.
    • International Asia and South Pacific Design Automation Conference (ASP-DAC): 2018, 2019.
    • IEEE Computer Society Annual Symposium on VLSI (ISVLSI): 2019
    • International Design and Test Symposium (IDT): 2015 and 2016.
  • Reviewer for International Journals:
    • IEEE Transactions on Electron Devices (TED): 2018, 2019.
    • IEEE Transactions on Circuits and Systems I: Regular Papers: 2019.
    • IEEE Transactions on Computers (TC): 2018.
    • IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD): 2014, 2015, 2016, 2017, 2018.
    • IEEE Transactions on VLSI Systems (TVLSI): 2017, 2018, 2019.
    • ACM Transactions on Design Automation of Electronic Systems (TODAES), 2016, 2018, 2019.
    • IEEE Embedded Systems Letters (ESL): 2017.
  • Reviewer for International Conferences (by myself or on behalf of Prof. Jörg Henkel): DATE, ICCD, ISPLED, DAC, CODES+ISSS, CASES, ISVLSI, ARCS, IESS, NOC, MSCOPES and other circuit and CAD conferences.

International Invited Talks

  • University of New South Wales, Sydney, Australia (UNSW), February, 2019.
  • New York University (NYU), Abu Dhabi, UAE, February, 2019.
  • National Chiao Tung University, Hsinchu, Taiwan (NCTU), March, 2019.
  • Macronix Company, Taipei, Taiwan, March, 2019.
  • Tsinghua University, Beijing, China, March, 2019.
  • Universidade Federal do Rio Grande do Sul, Brazil (UFRGS), scheduled in April, 2019.
  • Microelectronics Summer School, Pelotas, Brazil, scheduled in April, 2019.
  • Silvaco, Inc., Grenoble, France, April, 2018.
  • Korea University, Seoul, August, 2018.

Tutorials Held

  • “Design for Reliability in the Nano-CMOS Era: New Holistic Methodologies for Reliability Modeling and Optimization” in the International Asia and South Pacific Design Automation Conference (ASP-DAC), Japan, January, 2019.
  • “Design for Reliability: From Devices to Systems” in the 15th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), Czech Republic, July, 2018.
  • “Reliability: From Physics to CAD” in Design, Automation and Test in Europe (DATE), Germany, March, 2018.
     

Invited Talked at Workshops

  • “Reliable and Energy Efficient Guardbanding for Circuits Aging,” at the International Workshop on Cross-layer Resilience (IWRC), Seoul, South Korea, 2017.
  • “Containing Guardbands: From the Macro to Micro Time Domain,” at the Methoden und Beschreibungssprachen zur Modellierung und Verifikation von Schaltungen und Systemen (MBMV) Workshop, Bremen, Germany, 2017.
  • “Interdependencies of Aging Mechanisms,” at the International Workshop on Crosslayer Resilience (IWRC), Munich, Germany, 2015.

Special Session and Workshop Organization

  • Special Session: “A Journey from Physics to System Level on the Reliability Tracks” at the International Conference On Computer Aided Design (ICCAD), 2018.
  • Special Session: “Latest advances in variability impact on devices and circuits functionality” Special Session at the 15th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), Czech Republic, July, 2018.
  • Workshop on Machine Learning for CAD at the Design, Automation and Test in Europe (DATE), Florence, Italy, March, 2019.

Awards

  • Ph.D. was distinguished as “Summa cum laude” (mit Auszeichnung): around 5% of candidates may get it at the Computer Science department, KIT.
  • Seven European Network of Excellence on High Performance and Embedded Architecture and Compilation (HiPEAC) Paper Awards for FCCM13, DAC16, DAC17, DAC18, DAC19.
  • Top Student Award (First Rank) when receiving the B.Sc. degree (2007).