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Compact thermal simulation of liquid-cooled Integrated Circuits

Compact thermal simulation of liquid-cooled Integrated Circuits

Dr. Arvind Sridhar,
Ecole Polytechnique Federale de Lausanne (EPFL), Switzerland


February 28th, 13:00


Room H120 Technologiefabrik


This presentation will summarize the different novel compact modeling methods for the thermal simulation of 2D/3D integrated circuits with liquid cooling and other advanced thermal packages, that we have been developing over the last 4 years at the Embedded Systems Laboratory in EPFL.

The talk will be divided into four parts:

  1. In the first part, I will present 3D-ICE: a compact thermal model for single-phase liquid-cooled ICs.
  2. In the second part, I will present STEAM: a compact thermal model for two-phase liquid-cooled ICs.
  3. In the third part, I will present two independent approaches to accelerate thermal simulations using the thermal models described above.
  4. In the last part of the talk, I will present two approaches for optimised design of mirochannel heat sinks in liquid-cooled ICs based on the models described above.


Arvind Sridhar is a post-doctoral researcher at the Embedded Systems Laboratory at EPFL in Switzerland, working on compact mathematical modeling methods for various aspects of 3D Integration and packaging of ICs. He obtained his PhD in Electrical Engineering from EPFL in 2013.
Prior to that, he received the B. Eng degree (2006) in electronics and communication engineering from the College of Engineering Guindy, Anna University, India in 2006 and the M. A. Sc. degree (2009) in electronics´from Carleton University, Canada. He has worked at the Computer-Aided Design laboratory in Carleton University, and at the Thermal Packaging Group in IBM Research, Zurich.