Prof. Jörg Henkel is with Karlsruhe Institute of Technology (KIT), Germany, where he is directing the Chair for Embedded Systems CES. Before, he was a Senior Research Staff Member at NEC Laboratories in Princeton, NJ. He received his PhD from Braunschweig University with "Summa cum Laude".
Prof. Henkel has/is organizing various embedded systems and low power ACM/IEEE conferences/symposia as General Chair and Program Chair and was a Guest Editor on these topics in various Journals like the IEEE Computer Magazine.
He was Program Chair of CODES'01, RSP'02, ISLPED’06, SIPS'08, CASES'09, Estimedia'11, VLSI Design'12, ICCAD’12, PATMOS’13, NOCS’14 and served as General Chair for CODES'02, ISLPED’09, Estimedia’12, ICCAD’13 and ESWeek'16. He is/has been a steering committee member of major conferences in the embedded systems field like at ICCAD, ESWeek, ISLPED, Codes+ISSS, CASES and is/has been an editorial board member of various journals like the IEEE TVLSI, IEEE TCAD, IEEE TMSCS, ACM TCPS, JOLPE etc.
In recent years, Prof. Henkel has given more than ten keynotes at various international conferences primarily with focus on embedded systems dependability. He has given full/half-day tutorials at leading conferences like DAC, ICCAD, DATE etc. Prof. Henkel received the 2008 DATE Best Paper Award, the 2009 IEEE/ACM William J. Mc Calla ICCAD Best Paper Award, the Codes+ISSS 2015, 2014, and 2011 Best Paper Awards, and the MaXentric Technologies AHS 2011 Best Paper Award as well as the DATE 2013 Best IP Award and the DAC 2014 Designer Track Best Poster Award. He is the Chairman of the IEEE Computer Society, Germany Section, and was the Editor-in-Chief of the ACM Transactions on Embedded Computing Systems (ACM TECS) for two consecutive terms.
He is an initiator and the coordinator of the German Research Foundation's (DFG) program on 'Dependable Embedded Systems' (SPP 1500). He is the site coordinator (Karlsruhe site) of the Three-University Collaborative Research Center on "Invasive Computing" (DFG TR89). He is the Editor-in-Chief of the IEEE Design&Test Magazine. He holds ten US patents and is a Fellow of the IEEE.

Research Awards

• Embedded Systems Week, IEEE International Conference on Hardware-Software Co-design and System Synthesis (CODES+ISSS'15) Best Paper Award for "R2Cache: Reliability-Aware Reconfigurable Last-Level Cache Architecture for Multi-Cores", 2015.
• Embedded Systems Week, IEEE International Conference on Hardware-Software Co-design and System Synthesis (CODES+ISSS'14) Best Paper Award for "TSP: Thermal Safe Power - Efficient power budgeting for Many-Core Systems in Dark Silicon", 2014.
• DAC 2014 Designer Track Best Poster Award for poster "Application-Specific Hierarchical Power Management for Multicast High Efficiency Video Coding", 2014.
• Embedded Systems Week, IEEE International Conference on Hardware-Software Co-design and System Synthesis (CODES+ISSS'11) Best Paper Award for "Reliable Software for Unreliable Hardware: Embedded Code Generation aiming at Reliability", 2011.
• MaXentric Technologies AHS Best Paper Award for "Concepts, Architectures, and Run-time Systems for Efficient and Adaptive Reconfigurable Processors", 2011.
• William J. McCalla Best Paper Award ICCAD 2009 (IEEE/ACM Int'l Conference on Computer Aided Design) for "TAPE: Thermal-Aware Agent-Based Power Economy for Multi/Many-Core Architectures", 2009.
• Best Paper Award DATE 2008 Conference for "Run-time System for an Extensible Embedded Processor with Dynamic Instruction Set" (announced in April 2009).
• Various HiPEAC (European Network of Excellence on High Performance and Embedded Architecture and Compilation) Paper Awards between 2008-2015.

Research Nominations

• "Towards Aging-Induced Approximations" in: ACM/EDAC/IEEE 54rd Design Automation Conference (DAC'17), Best Paper Nomination.
• "Improving Mobile Gaming Performance through Cooperative CPU-GPU Thermal Management" in: ACM/EDAC/IEEE 53rd Design Automation Conference (DAC'16), Best Paper Nomination.
• "COREFAB: Concurrent Reconfigurable Fabric Utilization in Heterogeneous Multi-Core Systems" in: International Conference on Compilers, Architecture and Synthesis for Embedded Systems (CASES'14), Best Paper Nomination.
• "Reducing Inter-Core Cache Contention with an Adaptive Bank Mapping Policy in DRAM Cache" in IEEE International Conference on Hardware/Software Codesign and System Synthesis (CODES+ISSS'13), Best Paper Nomination.
• "Selective Instruction Set Muting for Energy-Aware Adaptive Processors" in IEEE/ACM International Conference on Computer-Aided Design (ICCAD´10), Best Paper Nomination.

Student Awards (Received by Master and PhD Students under my supervision)

• ACM SIGBED Paul Caspi Memorial Dissertation Award for the Ph.D. Thesis by Dr.Santiago Pagani entitled "Power, Energy, and Thermal Management for Clustered Manycores", 2017 (read more).
• European Design and Automation Association (EDAA) Outstanding Dissertations Award for the Ph.D. Thesis by Dr. Lars Bauer entitled "RISPP: A Run-time Adaptive Reconfigurable Embedded Processor", 2011 (read more).
• Hermann Billing Price for the Master Thesis of Florian Kriebel entitled "Analysis and Design of Hybrid Hardware/Software Reliability Techniques for Embedded Processors", 2011.
• FZI (Research Center Computer Science) Best Dissertation Award for the Ph.D. Thesis by Dr. Lars Bauer entitled "RISPP: A Run-time Adaptive Reconfigurable Embedded Processor", 2011 (read more).
• FZI (Research Center Computer Science) Best Master Thesis Award for the Master Thesis by Bastian Molkenthin entitled "Development of a Power-Aware Rate Controller for H.264 Video Encoder", 2008.

Personal Awards

• ACM Fellow (2023)
• ACM Distinguished Service Award from SIGDA (Special Interest Group on Design Automation), June 2018
• IEEE Fellow (effective Jan. 1 2015)
  for contributions to hardware/software codesign of embedded computing systems
• IEEE Outstanding Service Award from CEDA (Council on Electronic Design Automation)
  for service to the EDA community as ICCAD'13 General Chair, 2015
• "Summa cum Laude" for PhD Thesis, 1996

• "Power Density and Circuit Aging – System-Level Means for Mitigation" at IEEE Computer Society Annual Symposium on VLSI, Hong Kong, China, July 10^th, 2018 (read more).
• "Power Density and Reliability in Embedded On-Chip Systems" at 31^st International Conference on Vlsi Design & 17th International Conference on Embedded Systems, Pune, India, January 8^th, 2018, (read more).
• "The triangle of Power Density, Circuit Degradation and Reliability" at 30^th IEEE International System-On-Chip Conference, Munich, Germany, September 7^th, 2017, (read more).
• "Dark Silicon and Dependability" at the 18^th CSI International Symposium on Computer Architecture & Digital Systems (CADS 2015), Tehran, Iran, 2015, (read more).
• "Dependability of On-Chip Systems in the Dark Silicon Era" at the 32^nd IEEE International Conference on Computer Design (ICCD), Seoul, Korea, October 21^st, 2014, (read more).
• "The Dark Silicon Problem in Multi-Core Systems" at Thematic Session at HiPEAC Computer Systems Week 2014 (HiPEAC CSWeek), Barcelona, May 13^th 2014, (read more).
• "Adaptive Embedded Computing with i-Core" at 6^th Workshop on Adaptive and Reconfigurable Embedded Systems, CPSWeek (APRES), Berlin, April 14^th 2014, (read more).
• "Embedded On-Chip Reliability - It's a Thermal Challenge" at 16^th International Workshop on Software and Compilers for Embedded Systems (M-SCOPES 2013), St. Goar, Germany, June 20^th, 2013, (read more).
• "Embedded On-Chip Reliability - It's a Thermal Challenge" at 25^th Symposium on Integrated Circuits and Systems Design "Chip in Brasilia" (SBCCI / SBMicro, 2012), Brasilia, Brazil, September 1^st, 2012, (read more).
• "Dependable Software for Undependable Hardware" at 7^th IEEE International Symposium on Industrial Embedded Systems (SIES'12), Karlsruhe, Germany, Juny 20^th, 2012, (read more).
• "i-Core: A run-time adaptive processor for embedded multi-core systems" at International Conference on Engineering of Reconfigurable Systems and Algorithms (ERSA'11), Las Vegas, Nevada, July 20^th 2011, (read more).
• "Reliability of On-Chip Systems – A Thermal Perspective", at ISVLSI 2011 Conference, Chennai, India, July 4^th 2011, (read more).
• "Embedded Systems and the Reliability Challenge", at the 2008 World Computing Congress (WCC'08) at DIPES'08, Milano, Sept. 8^th 2008.

• H. Lekatsas, J. Henkel, S. Chakradhar, V. Jakkula:
  "Dynamic content-aware memory compression and encryption architecture",
  issued January 6th., 2009, US Patent No. 7,474,750
• H. Lekatsas, J. Henkel, S. Chakradhar, V. Jakkula:
  "Compressed memory architecture for embedded Systems",
  issued November 27th., 2007, US Patent No. 7,302,543
• S. Chakradhar, J. Henkel, V. Jakkula, H. Lekatsas, S. Murugan:
  "Hardware/software platform for rapid prototyping of code compression technologies",
  issued April 10th, 2007; US Patent No.7,203,935
• J. Henkel, H. Lekatsas, V. Jakkula:
  ”Apparatus for one-cycle decompression of compressed data and methods of operation thereof”,
  issued May 10th, 2005; US Patent No. 6,892,292
• J. Henkel, F. Vahid, T. Givargis, T.:
  "Method for core-based system-level power modeling using object-oriented techniques",
  issued March 8th, 2005, US Patent No. 6,865,526
• J. Henkel, H. Lekatsas:
  "Method and apparatus for adaptive bus coding for low power deep submicron designs",
  issued May 25th., 2004, US Patent No. 6,741,190
• J. Henkel, W.Wolf, H. Lekatsas:
  "Method and apparatus for object code compression and decompression for computer systems",
  issued May 4th., 2004, US Patent No. 6,732,256
• J. Henkel, W.Wolf, H. Lekatsas:
  "Object code compression using different schemes for different instruction types",
  issued Febr. 10th., 2004, US Patent No. 6,691,305
• J. Henkel:
  "Low power hardware/software partitioning approach for core-based embedded systems",
  issued Sept. 16th., 2003, US Patent No. 6,622,287
• J. Henkel, H. Lekatsas:
  "Method and apparatus for adaptive bus coding for low power deep sub-micron designs",
  issued June 24th., 2003, US Patent No. 6,583,735

The IEEE Design&Test Magazine
 

Conferences I regularly attend

• Design Automation Conference (DAC)
• Embedded Systems Week (ESWeek)
• International Conference on CAD (ICCAD)

Professional Societies

• ACM SIGDA (Special Interest Group on Design Automation)
• IEEE CEDA (Council of Electronic Design Automation)
• IEEE Computer Society

Research Resources

• DBLP
• GoogleScholar
• LinkedIn