Abstract
This talk consists of two parts: 1) thermal modeling and 2) power/thermal management. In the first part, I will present our practical thermal modeling techniques based on HotSpot (which is famous architectural thermal modeling tool), which was validated against a commercial application processor. In the second part, I will present software power/thermal management techniques, which is easy to understand intuitively. Only in this case, the techniques can be adopted by industry. The evaluation results were also measured on commercial smartphones. In this talk, there is no complicated equations! Instead, I will conceptually explain the proposed techniques.

Bio
Sung Woo Chung received the BS, MS, and PhD degrees in Electrical Engineering and Computer Science from Seoul National University, in 1996, 1998, and 2003, respectively. He was a senior engineer in Samsung Electronics from 2003 to 2004. In 2005, He was a research scientist in University of Virginia. Since 2006, he is a professor in the Department of Computer Science, Korea University, Seoul, Korea. His research interests include low-power design, temperature-aware design, and user-aware design. He had been an Associate Editor of IEEE Transactions on Computers from 2010 to 2015. He was the Technical Program Co-Chair of the IEEE International Conference on Computer Design in 2015. He serves (and served) on the technical program committees in many conferences, including Design Automation Conference (2015-2018), International Symposium on Low Power Electronics and Design (2016-2019), and International Parallel and Distributed Processing Symposium (2017-2018). He is a senior member of IEEE.