IEEE Design&Test Vol. 37, Issue 4

  • Speaker:
    Special Issue on VTS
  • Location:

    IEEE Explorer

  • Date: July/August
Design & Test

Magazine
Volume 37, Issue 4 (July/August)

Highlights
Special Issue on "Special Issue on VTS"
Tutorial by Sudeep Pasricha and Mahdi Nikdast "A Survey of Silicon Photonics for Energy-Efficient Manycore Computing"
General Interest Paper by  Jun Wang and Jiaquan Gao "Parallelizing GPGPU-Sim for Faster Simulation with High Fidelity"
General Interest Paper by Arjun Chaudhuri, Sanmitra Banerjee, Heechun Park, Jinwoo Kim, Gauthaman Murali, Edward Lee, Daehyun Kim, Sung Kyu Lim, Saibal Mukhopadhyay, and Krishnendu Chakrabarty "Advances in Design and Test of Monolithic 3-D ICs"
General Interest Paper byChia-Hua Wu, Shi-Yu Huang, Yung-Fa Chou, and Ding-Ming Kwai "Time-to-Digital Converter Compiler for On-Chip Instrumentation"

July/August 2020 Content


From the EIC
Special Issue on VTS
  View full article (PDF).

Special Issue on VTS
Selected Papers from IEEE VLSI Test Symposium
  View full article (PDF).
Silicon-Proven Timing Signoff Methodology Using Hazard-Free Robust Path Delay Tests
  Ensuring a tight correlation between pre-silicon static timing analysis (STA) and post-silicon timing analysis is essential to a robust design flow. Researchers from Intel describe a novel methodology to validate path level STA on silicon using standard scan architecture and path delay tests that are generated by commercial EDA tools. read more
View full article (PDF).
Scan Integrity Tests for EDT Compression
  Scan chains are the fundamental building blocks for DFT, and testing for scan integrity is the first step in a robust test methodology. This article describes scan integrity tests for embedded test compression structures. read more.
View full article (PDF).
Testing of Prebond Through Silicon Vias
  Testing of the interconnects in a 3-D stack is a complex and expensive process. The authors propose a method using prebond testing to reduce manufacturing cost and improve overall yield. read more.
View full article (PDF).
Determining Mechanical Stress Testing Parameters for FHE Designs with Low Computational Overhead
  Flexible hybrid electronics have complex mechanical stress failure mechanisms. Researchers from ASU propose a novel method to obtain the optimum set of mechanical stress patterns to cover all potential fault locations and exert the required mechanical stress as dictated by the application. read more
View full article (PDF).
Know Your Channel First, then Calibrate Your mmWave Phased Array
  This article proposes a new method for calibration of high-speed phased array antennas that includes all the system components and spans the full chain of communication. Online calibration is possible without pausing or interrupting the communication processing in any way. read more
View full article (PDF).
Hardware-Based Real-Time Workload Forensics
  Workload forensics is a key component of software security that collects and analyzes information to identify suspicious behavior. Researchers from UT Dallas explore a hardware alternative since it is immune from software attacks and does not rely on data collected from the OS or software applications. read more
View full article (PDF).

General Interest Papers
Parallelizing GPGPU-Sim for Faster Simulation with High Fidelity
  GPGPU-Sim is widely used for simulating GPU performance. Hence, creating a parallel version of this tool is very useful to the broader research community. This article presents various characteristics of a parallel GPGPU-Sim simulator. read more
View full article (PDF).
Advances in Design and Test of Monolithic 3-D ICs
  Monolithic 3-D (M3D) technology enables unprecedented degrees of integration on a single chip. The miniscule monolithic intertier vias (MIVs) in M3D are the key behind higher transistor density and more flexibility in designing circuits compared to conventional through silicon via (TSV)-based architectures. read more
View full article (PDF).
Time-to-Digital Converter Compiler for On-Chip Instrumentation
  This article proposes an automatic compiler for an on-chip time-to-digital converter (TDC) that can be used for monitoring the on-chip operating conditions such as temperature and supply voltage. The proposed compiler adopts a resilient architecture and supports self-calibration and range adjustment. read more
View full article (PDF).

Tutorial Paper
A Survey of Silicon Photonics for Energy-Efficient Manycore Computing
  Silicon photonics is an emerging paradigm for designing energy-efficient and high-performance communication backbone for manycore chips. This article presents a survey about designing photonic on-chip infrastructure. read more
View full article (PDF).

Departments
The Last Byte: My Friendly Orange Glow
  View full article (PDF).